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Extending Polishing Pad Life

IP.com Disclosure Number: IPCOM000066875D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Holley, B Kaplan, P Mendel, E [+details]

Abstract

Polishing pads for polishing silicon wafers are reconditioned between runs by using alcohol or a mixture of alcohol and water. For example, a 10:90 methyl alcohol:water mixture is prepared and the used pad, which contains polishing slurry and residue, is thoroughly wetted with the mixture. The pad is then rubbed with a soft bristle brush, and the residues are rinsed away with water. The lower alcohol ranges are preferred for safety reasons.