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E-Beam Mapping Of Packaging Substrate Registration Vias

IP.com Disclosure Number: IPCOM000066876D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Caccoma, GA Freisitzer, N O'Neill, BC Simpson, RA [+details]

Abstract

Elimination of registration marks from the product areas of the top surface metallurgy layers of packaging substrates, written by an electron (E)-beam lithographic tool, requires mapping of registration mark (via) locations in the substrate after firing.