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Oxygen Plasma Treatment To Eliminate Resist Polymer Redeposition

IP.com Disclosure Number: IPCOM000066878D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Carr, PE Fried, LJ Moyer, WA [+details]

Abstract

Methyl methacrylate-methacrylic acid resist copolymer layers, which contain anhydride segments, are treated, before development, in an oxygen plasma. The treatment can take place after patternwise radiation exposure of the layers and prevents the redeposit of unexposed resist into developed areas of the resist during the development, washing and drying process.