Browse Prior Art Database

Solder Volume Optimization

IP.com Disclosure Number: IPCOM000066879D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Herdzik, RJ Totta, PA [+details]

Abstract

Use of decals to transfer solder pads to a substrate has been previously described (*).