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Electromigration Improvement Of Al-Cu Or Au Conductors

IP.com Disclosure Number: IPCOM000066882D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Howard, JK [+details]

Abstract

The use of Al-transition metal intermetallic compound layers for electromigration improvement of Al-Cu conductors is described in U. S. Patent 4,017,890. The intermetallic phase provided a conductive (300- 500 mu omega cm) link between the Al-Cu layers, as shown in Fig. 1.