Internal Temperature Monitoring Apparatus For Multilayer Ceramic Substrates
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20
In the design of multilayer ceramic (MLC) modules it is desirable to obtain optimum cooling conditions for the substrate during operation. To facilitate this design, the thermal gradients existing from the chip, across the solder joints, and into the substrate must be known. These thermal gradients will determine the nature of the cooling enhancement which will be used to operate the particular device and substrate combination. In order to measure these thermal gradients, an internal thermocouple must be planted in the substrate.