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Technique For The Suppression Of Self Sustained Discharges During The RF Sputter Etching Of Aluminum Alloy Substrates

IP.com Disclosure Number: IPCOM000066955D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lester, WC McDonough, GW [+details]

Abstract

The RF sputter etching of aluminum alloy substrates is hampered by self-sustained discharges forming on the surfaces of the aluminum tooling located in a RF sputter etch system vacuum chamber. The RF matching network automatically tunes itself to support these discharges. When the aluminum surfaces were replaced with stainless steel surfaces, these discharges were eliminated for the first sputter etch cycle only. After sputter etched aluminum alloy was deposited on the stainless steel surfaces and the vacuum chamber vented to atmosphere, self sustained arcing would then occur on the previously deposited aluminum alloy coating during the subsequent sputter etch cycle.