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Triode System For Plasma Etching

IP.com Disclosure Number: IPCOM000066966D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Chapman, BN [+details]

Abstract

A hot filament plasma etching method for etching semiconductor chips or other substrate surfaces at controlled rates and with controlled etch profiles uses the apparatus shown in the drawing.