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Epoxy Preform For Back Sealing Electronic Modules

IP.com Disclosure Number: IPCOM000067033D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Escott, BM Schuessler, PW Wheater, RH [+details]

Abstract

In the manufacture of electronic components, it is often necessary to provide a back seal on the pin side of integrated circuit modules. This method provides a preform for use as a back seal which inhibits the curing of the sealant polymer and has an extended shelf life. The sealant components are mixed in the absence of a solvent and then compressed into the desired preform shape.