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Three Legged Solder Reflow Bonding Tip

IP.com Disclosure Number: IPCOM000067037D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Houser, DE [+details]

Abstract

A three-legged bonding tip is described in the IBM Technical Disclosure Bulletin 18, 3984 (May 1976). Because of the different current magnitudes used in each of the legs, thermal stresses are induced in the tip, which reduce its life.