Three Legged Solder Reflow Bonding Tip
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20
A three-legged bonding tip is described in the IBM Technical Disclosure Bulletin 18, 3984 (May 1976). Because of the different current magnitudes used in each of the legs, thermal stresses are induced in the tip, which reduce its life.