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One Piece Snap On Heat Sink

IP.com Disclosure Number: IPCOM000067038D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Andros, FE Kunkler, EW Pedroza, GC Shay, RJE [+details]

Abstract

Fig. 1 illustrates a one-piece heat sink which snaps on a module, as in Fig. 2. The folded strip, base and spring tabs are composed of a copper alloy which provides excellent thermal properties along with spring properties (i.e., beryllium - copper alloys) to both snap attach and efficiently dissipate heat. The folded strip is soldered to the base to provide the optimum bond between the fins and base. The copper alloy can be initially coated on one surface with solder to effect the solder joint. To assure an efficient thermal joint between the cap and heat sink a layer of thermal grease, or a similar thermal compound, is provided. To prevent copper corrosion a protective nickel plating or similar inexpensive metal plate can be incorporated in the design. The heat sink is formed as follows: 1.