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Mixed Electroless and Electroplated Nickel Areas on Multilayer Ceramic Modules Disclosure Number: IPCOM000067047D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

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Harvilchuck, JM Schmeckenbecher, AF [+details]


This process is a less complicated technique for plating the required nickel layer on pads and on other areas of a multilayer ceramic substrate.