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This process is a less complicated technique for plating the required nickel layer on pads and on other areas of a multilayer ceramic substrate.
English (United States)
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Mixed Electroless and Electroplated Nickel Areas on Multilayer Ceramic
This process is a less complicated technique for plating the required nickel
layer on pads and on other areas of a multilayer ceramic substrate.
Electrolessly deposited nickel-phosphorous on molybdenum pads on a
multilayer ceramic module is more stressed, tends to crack, and is more readily
eroded by liquid solder or braze than electroplated nickel. Therefore, it is
desirable to plate as many pads as possible, and the seal band, with
electroplated nickel. However, in electroplating, the pads must have an electrical
connection to pads or the like on the other side of the module which can be
connected to a power supply. Design considerations frequently require that
some pads on multilayer ceramic modules are not directly connected to any pads
or connections on the opposite sides of the module. Such floating pads should at
least be coated with electroless nickel to prevent excessive corrosion of the
molybdenum and to make them wettable by braze or solder.
In this process. all pads and the seal bands are coated with an electroless
nickel coating by any suitable technique. for example, the technique disclosed in
IBM Technical Disclosure Bulletin 20, 3079 (January 1978). Then the pads, seal
band, etc., on one side of the module; which are connected to the other side, are
electroplated with nickel on top of the initial electroless nickel-phosphorous layer
in a rack 10 supporting substrate 12...