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Module Heat Pipe Cooling Structure

IP.com Disclosure Number: IPCOM000067051D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Gokhale, BV Jones, CF Mansuria, MS Stoller, HI [+details]

Abstract

A heat pipe is used to remove the heat generated in high power, high density multi-chip modules. A heat pipe is a device which can conduct a very large quantity of heat with practically no temperature drop. This makes it possible to cool a module much more efficiently than with conventional approaches.