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Air and Liquid Drop Cooled Module

IP.com Disclosure Number: IPCOM000067053D
Original Publication Date: 1979-Jun-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lynch, JR [+details]

Abstract

This article describes a unique means of minimizing the interfacial thermal resistance between a chip backside (silicon) and a cap which may or may not have conventional fins or other cooling members. Using the concept of surface tension and capillary force, a liquid drop of conductive fluid (GaIn alloy, silicone oil, conductive oils or other organic fluids) can be between two surfaces, forming a liquid contact. Part of the cap may be a capillary which can provide a reservoir for the fluid as well as maintain the forces necessary to hold the liquid in place. The capillary may be a hollowed-out rod, a porous surface, a powder metal part or any specific surface which holds in place the drop of conductive fluid.