Browse Prior Art Database

Low Cost Circuit Packaging

IP.com Disclosure Number: IPCOM000067252D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Wadhwa, SK [+details]

Abstract

A conventional circuit package where a circuit chip is mounted on a substrate, enclosed in a module and then mounted on a card and board, is relatively expensive for low end users, particularly if reliability requirements are not high. The arrangement described herein provides a low-cost package.