Browse Prior Art Database

Low Cost Stacked Module

IP.com Disclosure Number: IPCOM000067254D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Rasile, J Seraphim, DP Werbizky, GG [+details]

Abstract

It is conventional to mount integrated circuit chips on metallized ceramic substrates. Pins then extend from the metallized ceramic substrate to a printed circuit board. In complex circuitry, it is sometimes difficult to distribute the connections from the integrated circuit chip to the pins.