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Low Cost Stacked Module Disclosure Number: IPCOM000067254D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

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Rasile, J Seraphim, DP Werbizky, GG [+details]


It is conventional to mount integrated circuit chips on metallized ceramic substrates. Pins then extend from the metallized ceramic substrate to a printed circuit board. In complex circuitry, it is sometimes difficult to distribute the connections from the integrated circuit chip to the pins.