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Dendritic Heat Sink

IP.com Disclosure Number: IPCOM000067260D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Van Vestrout, VD [+details]

Abstract

A heat sink for a circuit module is joined to the module by dendritic metal surfaces, as shown in the drawing. The heat sink base 3 is provided with a plurality of cooling fins 5 and its lower surface is treated to form metal dendrites 7 by any suitable method.