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Gamma Radiation Treatment To Enhance The Unzipping Of Poly (Proportional to) Methylstyrene

IP.com Disclosure Number: IPCOM000067263D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Anderson, HR Mittal, KL Turetzky, MN [+details]

Abstract

Multilayer ceramic substrates for mounting semiconductor chips are formed by laminating together a number of green sheets comprised of powdered ceramic material in an organic polymer binder. The laminate is fired to drive off the organic binder and sinter the powder into a hard substrate. The firing temperature at which a poly-(proportional to)- methylstyrene can be completely removed is significantly lowered (60 degrees, for example) by subjecting the polymer to gamma radiation in a dose range of about 5 - 10 M Rad as determined by thermal gravimetric analysis before and after gamma radiation treatment of the pure poly-(proportional to)-methylstyrene sample.