Gamma Radiation Treatment To Enhance The Unzipping Of Poly (Proportional to) Methylstyrene
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20
Multilayer ceramic substrates for mounting semiconductor chips are formed by laminating together a number of green sheets comprised of powdered ceramic material in an organic polymer binder. The laminate is fired to drive off the organic binder and sinter the powder into a hard substrate. The firing temperature at which a poly-(proportional to)- methylstyrene can be completely removed is significantly lowered (60 degrees, for example) by subjecting the polymer to gamma radiation in a dose range of about 5 - 10 M Rad as determined by thermal gravimetric analysis before and after gamma radiation treatment of the pure poly-(proportional to)-methylstyrene sample.