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One-Component Conductive Paste/Resist System Disclosure Number: IPCOM000067266D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

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Kaplan, P Korcolczyk, R Suierveld, J [+details]


In multilayer ceramic substrates, gold is electroplated onto metal pads by connecting the cathode to the backside metallurgy. A screened-on conductive paste provides a conductive path from the backside metallurgy to the pads. The plating of gold onto the conductive paste is avoided by forming a nonconductive path over the paste which consists of a mixture of conducting metal powder in a filler-free ultraviolet (UV) sensitive resist material (any nonconductive resist can be used). After screening, the conductive metal powder particles settle out and provide a low resistance contact to the pads. The resist is then exposed to UV light to cause polymerization.