One-Component Conductive Paste/Resist System
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20
In multilayer ceramic substrates, gold is electroplated onto metal pads by connecting the cathode to the backside metallurgy. A screened-on conductive paste provides a conductive path from the backside metallurgy to the pads. The plating of gold onto the conductive paste is avoided by forming a nonconductive path over the paste which consists of a mixture of conducting metal powder in a filler-free ultraviolet (UV) sensitive resist material (any nonconductive resist can be used). After screening, the conductive metal powder particles settle out and provide a low resistance contact to the pads. The resist is then exposed to UV light to cause polymerization.