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Ultra-High Vacuum Evaporation/Sputtering Apparatus For Cryogenic Thin Film Technology

IP.com Disclosure Number: IPCOM000067269D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Carbone, OJ Caulfield, JJ Nowakowski, L Petvai, SI Wernikowski, RC [+details]

Abstract

This apparatus comprises four basic assemblies: (1) wafer nest assembly, (2) fluid or gas cooling manifold, (3) colled and rotating RF feedthrough, and (4) vacuum tooling. The wafer nest assembly includes (a) base assembly 1, (b) wafer clamping ring 2, (c) spring clip 3, (d) mask and spacer ring 4, and (e) wafer 5.