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This article describes an electroplating fixture for the electrodeposition of nickel on the braze band of multilayer ceramic substrates.
English (United States)
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Page 1 of 2
Multilayer Ceramic Substrate Electroplating Rack
This article describes an electroplating fixture for the electrodeposition of
nickel on the braze band of multilayer ceramic substrates.
The above drawing shows the fixture assembled and ready for use. The
substrate 1 is placed, top surface down, in the window 2 against the gasket 3
held in place by the support pedestal 4. This position leaves the substrate braze
band exposed and facing the anode 5. As the sealing cover 6 with its attached
gasket 7 is tightened down, the substrate 1 braze band is forced into electrical
engagement with the cathode contacts 8.
The internal chambers formed by the gaskets 3 and 7 are purged with
nitrogen through the nitrogen ports 9, creating positive pressure which prevents
plating or cleaning solutions from contacting any area of the substrate except the
band to be plated. A sheet of anode material 10 covers the anode. The nitrogen
11 and electrical power 12 are supplied through connections at the handle. The
sides 13 are relieved to permit maximum solution flow through the fixture.
Although the above describes a fixture for a single substrate, multiple window
fixtures may utilize the same design.
If the anode material is changed, any conventional electro-deposit, such as
tin, copper, gold or silver, may be applied.
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