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Method For Fabricating Pins At Silicon Edges By EDM

IP.com Disclosure Number: IPCOM000067396D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lahiri, SK Siegel, AR [+details]

Abstract

In cutting silicon by means of electrical discharge machining (EDM), conventional EDM electrodes, such as tungsten and molybdenum wire, may be utilized. However, when it was required to cut pins .001" wide by .008" long at the edge of a silicon wafer which was doped to be conductive, it was found, using the conventional electrodes, that pins of the above dimensions fractured.