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Laser Welded Package For Semiconductor And Superconductor Electronics

IP.com Disclosure Number: IPCOM000067397D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Melcher, RL [+details]

Abstract

A method for laser welding of semiconductor chips to a substrate is described.