Casting Technique For Large Area, Thin Films Of Polymer Solutions
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20
In the IBM Technical Disclosure Bulletin 13, 1266 (October 1970), a method is described for applying very thin photoresist layers to substrates. The technique includes the formation of a thin film of the resist in a ring and then film transfer by passing the ring over the substrate or wafer to be coated. The film is formed by dipping the ring into a solution of resist with the appropriate surface tension. This technique has been successfully used on one-inch semiconductor wafers. This article shows a thin, polymer-film casting technique suitable for coating 2-1/4-inch and larger wafers.