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Casting Technique For Large Area, Thin Films Of Polymer Solutions

IP.com Disclosure Number: IPCOM000067399D
Original Publication Date: 1979-Jul-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Jaeger, TH Lussow, RO Wirtz, LH [+details]

Abstract

In the IBM Technical Disclosure Bulletin 13, 1266 (October 1970), a method is described for applying very thin photoresist layers to substrates. The technique includes the formation of a thin film of the resist in a ring and then film transfer by passing the ring over the substrate or wafer to be coated. The film is formed by dipping the ring into a solution of resist with the appropriate surface tension. This technique has been successfully used on one-inch semiconductor wafers. This article shows a thin, polymer-film casting technique suitable for coating 2-1/4-inch and larger wafers.