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Laser Personalization Tool Disclosure Number: IPCOM000067418D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

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Belyeu, SM Budo, Y Choberka, JM Smith, JF [+details]


This tool provides shorter turn-around time to personalize integrated circuit devices. Prior research has shown that short laser pulses can be used to weld the connections between metal layers and also between metal layers and silicon to personalize specially prepared integrated circuit (IC) devices such as programmable logic arrays (PLAs) and functional storage units/read-only storage (FSUs/ROS). The laser personalization tool (Figs. 1-3) consists of: A. Optical bench 1 with(a) Dye laser assembly 2 (b) X-Y- Theta positioning table 3 (also referred to as X-Y-Rotary) (c) Substrate fixture 4 with 0x, 0y, and Z motions (d) Closed Circuit Television (CCTV) camera 5. B.