Browse Prior Art Database

Stacked MC Module With Variable Size Substrates

IP.com Disclosure Number: IPCOM000067445D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Cutting, LR Hoffman, KM [+details]

Abstract

It is well known that increased density can be achieved in electronic packaging by stacking a plurality of substrates on top of each other and interconnecting the substrates utilizing pins. Generally, in such packages, the substrates which are stacked have the same dimensions.