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Stacked MC Module With Variable Size Substrates Disclosure Number: IPCOM000067445D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Cutting, LR Hoffman, KM [+details]


It is well known that increased density can be achieved in electronic packaging by stacking a plurality of substrates on top of each other and interconnecting the substrates utilizing pins. Generally, in such packages, the substrates which are stacked have the same dimensions.