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Programmable Heat Sink Device For Thermal Enhancement

IP.com Disclosure Number: IPCOM000067451D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Bakos, P Hoffman, KM Rivenburgh, DL Wang, IH [+details]

Abstract

Shown above is a heat sink design which can be implemented to cool metallized ceramic modules. The heat sink is preferably made of copper, and it has a flat surface at the top to ensure adequate contact with the module-encapsulating cap. A suitable thermal grease is placed between the heat sink and the cap. The bottom portion of the heat sink is also flat and contains one or more radiation sinks, one of which is directly over the circuit chip and separated therefrom by thermal grease. The radiation sinks remove additional heat through absorption of radiant energy. The heat sink is also provided with heat pipes which not only enhance cooling, but also support the heat sink rather than have the chip support it.