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Attachable Heat Sink For Pluggable Modules

IP.com Disclosure Number: IPCOM000067453D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
DeMaine, FJ Petrozello, JR Tomek, RE [+details]

Abstract

Economic considerations dictate that a module be treated as a field replaceable unit, and for this reason modules are being made pluggable. Because of the large number of circuits per chip and chips per module, it may be necessary in many cases to enhance module heat transfer by having a finned module cap. In order to stay with processes of module fabrication which can only handle unfinned caps, it is desirable to add the heat sink fins after standard module fabrication. Furthermore, in field repair, it is economically advantageous to carry and stock the least number of parts possible. Therefore, it is desirable to field remove the heat sink from the defective module and field-attach it to the new standard replacement module.