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Module Package With Thermal Connection From Chip To Cap

IP.com Disclosure Number: IPCOM000067454D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Pedroza, GC Shay, JE [+details]

Abstract

In the package shown above, the integrated circuit chip 10 has a thermal connection 15 to the module cap 20. The thermal connection is a solder connection between the integrated circuit chip 10 and the module cap 15. Naturally, this solder does not make electrical contact with any of the electrical circuitry on the chip 10. The underside of cap 20 also has layers of circuitry 21. This circuitry can be conventional chrome copper chrome circuitry which is deposited on a polyimide layer 22. The polyimide layer 22 separates the circuitry 21 from the cap 20. Circuitry on integrated circuit 10 makes contact with the circuitry on cap 20 via solder ball connections 23.