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Semiconductor Solder Pad Rework Technique

IP.com Disclosure Number: IPCOM000067472D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Galyon, GT Lee, AP McCollum, JM [+details]

Abstract

This technique makes possible the salvaging of semiconductor wafers which have either low solder compositions or an insufficient volume of solder.