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Ceramic Reflow Weight For Production Of A Flat Void Free Tinned Metal Band On Substrates

IP.com Disclosure Number: IPCOM000067473D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Poweleit, HR Smith, CG [+details]

Abstract

A reflow operation is sometimes used to produce a flat parallel tinned surface required for subsequent assembly operations in semiconductor package fabrication. This is accomplished in conjunction with the brazing of pins 1 to the substrate 2 of multilayer ceramic packages.