Ceramic Reflow Weight For Production Of A Flat Void Free Tinned Metal Band On Substrates
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20
A reflow operation is sometimes used to produce a flat parallel tinned surface required for subsequent assembly operations in semiconductor package fabrication. This is accomplished in conjunction with the brazing of pins 1 to the substrate 2 of multilayer ceramic packages.