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Fabricating Small Diameter, Vertical Conductors With Reduced Cracking In MLC Substrates

IP.com Disclosure Number: IPCOM000067475D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Delio, RC [+details]

Abstract

Small diameter, vertical conductors or vias in multilayer ceramic (MLC) substrates may be shaped to reduce stress concentration. By forming voids in the conductive paste prior to firing, the diameter of the fired via is reduced and reshaped from a cylinder to a hyperboloid or hourglass configuration. The hyperboloid or hour-glass configuration reduces the tendency for the vias to crack and lowers capacitance.