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Hardware Technique For Processing Electron Beam Backscatter Signal For Registration Disclosure Number: IPCOM000067478D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

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Davis, DE Jackson, RD Williams, MC Woodard, OC [+details]


In electron (E)-beam lithography, when overlaying previously processed layers, the deflection must be finely aligned with the target chips. This is normally done by collecting backscatter signals while scanning special alignment mark areas on each chip and processing those signals to generate deflection corrections.