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This substrate which utilizes a multilayer ceramic with buried conductive lines has improved corrosion resistance of the line metallurgy exposed to droplets of ink in an ink jet printer application.
English (United States)
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Substrate For Ink Jet Printer
This substrate which utilizes a multilayer ceramic with buried conductive
lines has improved corrosion resistance of the line metallurgy exposed to
droplets of ink in an ink jet printer application.
A technique for producing a charge plate substrate (Fig. 1) for an ink jet
printer is to build up a plurality of green ceramic sheets 10 with conductive lines
18, sinter the sheets to form a substrate 16, and subsequently grind grooves 14
in the end, as indicated in Fig. 1.
In order to protect the ends of buried conductive lines 18
(Fig. 2), which are usually of a refractory metal, from the ink, a
plug 20 is deposited on the end of each line 18 to protect the
latter. The plugs 20 are formed after the ends of the conductive
lines 18 are exposed by grinding. Upon exposing the ends of lines
18 to an etchant which results in their being etched back from the
bottom surface of grooves 14, plugs 20 are then electroplated in the
resulting recesses and the layer 22 deposited on the inside of the
grooves 14 by any suitable technique for example, sputter deposition.
The conductive metal of layer 22 and plug 20 can be of any suitable
type that is resistant to corrosion of the ink. A typical metal is
In order to electrically isolate the portions of layer 22 in the respective
grooves 14, the layer 22 is ground off the ends of lines 24.
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