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Modular Cap Mounting Disclosure Number: IPCOM000067505D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

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Aakalu, N [+details]


The figure shows an improved way to mount a cap 11 to a ceramic substrate 13 so as to obtain close dimensional control of the thickness of thermal conducting grease 15 between cap 11 and an integrated circuit chip 17. Prior mounting included shoulders 19 within cap 11 to register with the top surface edges of substrate 13. The shoulders 19 were held against the substrate 13 by crimping the bottom skirt of cap 11, as shown at 21.