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This technique permits the monitoring of all solder pads on the module using a combination of an individual and series four point resistance measurement.
English (United States)
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Resistance Measurements Of Solder Pads
This technique permits the monitoring of all solder pads on the module using
a combination of an individual and series four point resistance measurement.
As shown in the figure, all pads marked I are monitored with individual four
point measurements. The pads marked D2 are monitored by subtracting two
individual four-point measurements from a series reading of four pads. The
pads marked D3 are monitored by subtracting one individual four-point pad
measurement from a series measurement of four pads. The pads marked D5
are monitored in the same manner as pads marked D2 and D3, while pads
marked S4 are monitored by series measurement of four pads. In a series
measurement of four pads the change for any individual pad can be expected to
be the resistance change for the four pads divided by four or the number of pads
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