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Resistance Measurements Of Solder Pads

IP.com Disclosure Number: IPCOM000067529D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Gorgas, WE [+details]

Abstract

This technique permits the monitoring of all solder pads on the module using a combination of an individual and series four point resistance measurement.