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The thickness of a film 1 that is being plated is monitored by the use of a monitor film 2 and reference film 3, disposed in a plating solution 4 contained in a tank 5.
English (United States)
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Thickness Monitor For Plated Film
The thickness of a film 1 that is being plated is monitored by the use of a
monitor film 2 and reference film 3, disposed in a plating solution 4 contained in a
The resistance difference between the film 2 and reference film 3 is
measured while they are both submerged in the solution 4. The film 2 is used to
monitor the plating process which controls plating parameters, such as
composition and thickness.
To measure the film thickness while the film 1 is being plated, a Wheatstone
bridge 6 is connected to a detection circuit, consisting of an amplifier 7 and
analog-to-digital converter 8.
Assuming that resistance R(1) is equal to resistance R(2), the voltage
between points A and B will depend upon the difference seen at resistances R(3)
and R(4). This difference is determined by the thickness of the reference film 3
and monitor film 2.
The voltage between points A and B is sensed and amplified and converted
to a digital readout. When the voltage reaches 0 and the bridge is in a balanced
condition, then the plating process is terminated. In this way, the thickness of
the plated film can be precisely controlled.
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