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Mercury Filling Of Small Sockets

IP.com Disclosure Number: IPCOM000067583D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Sokolowski, J [+details]

Abstract

The formation of connections between pins and interconnection lines in a packaging application requires that small sockets in silicon wafers be filled with mercury. Sockets in a wafer can be filled simultaneously using apparatus shown in the above figure.