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Plasma Polishing Of Substrates

IP.com Disclosure Number: IPCOM000067586D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Krongelb, S Romankiw, LT [+details]

Abstract

It is possible to add a small percentage of oxygen to an atmosphere of argon in a sputtering chamber from which air has been evacuated to sputter etch gold, palladium and platinum selectively with respect to metals such as titanium and nickel. (See U.S. Patents 3,856,648; 3,836,456; and 3,808,108.) This article pertains to another aspect of the above phenomenon, which is that it can be employed for the purpose of polishing of a rough surface of a material such as Au or Al(2)0(3).