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Method For Fabricating Chip-To-Carrier Detachable Solder Joints Disclosure Number: IPCOM000067591D
Original Publication Date: 1979-Aug-01
Included in the Prior Art Database: 2005-Feb-20

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Geldermans, P [+details]


This article describes a method for remelting solder joints to permit the removal of a silicon chip, the contacts of which have been previously joined to a carrier, without undue exposure of the chip or carrier to heat. This is achieved by heating up the joints directly by applying focussed energy in the form of infrared, laser or electron beams. One way to achieve access to the joint is to provide cavities in a <100> oriented silicon chip using well-known anisotropic etching techniques.