Low Force Pin Assembly
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20
In the fabrication of ceramic substrates, hole locations which are later to accept pins for making electrical connections will shift due to thermal response of the ceramic when it is fired. Force fit of the pins by fixture thereafter then results in significant ceramic cracking and breakage due to pin and pin hole misalignment which cannot be accurately predicted or controlled. Further, even when the shift in pin hole location is small enough to accept an inserted pin, that pin will often be cocked or misaligned within the pin hole. Subsequent pin heading or bulging forces, intended to lock the pin in place, will crack the substrate when applied to the misaligned pins.