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Pin Insertion Process

IP.com Disclosure Number: IPCOM000067676D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
DeMarco, JL Ward, WR Williams, GL [+details]

Abstract

A process for inserting pins into ceramic substrate through holes is described below. The process utilizes a combination of pin displacement in a direction normal to the substrate plane and vacuum at the exit side of the substrate holes to assist pin alignment.