Browse Prior Art Database

Module Cap With Heat Sink

IP.com Disclosure Number: IPCOM000067680D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Chen, WT Engel, PA Lim, CK Pedroza, GC [+details]

Abstract

The integrated circuit module shown above includes a conventional substrate 15 which has mounted thereon an integrated circuit chip 16. The integrated circuit chip 16 has solder connections 17 to circuitry (not shown) on ceramic substrate 15. The module has a plurality of conventional pins 30 (only two of which are shown) to make circuit connections to external circuitry.