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Module Package With Heat Sink Between Substrate And Circuit Board

IP.com Disclosure Number: IPCOM000067681D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Stackhouse, HD [+details]

Abstract

Shown above is a module which includes a plurality of integrated circuit chips 11 mounted on a conventional metallized ceramic substrate 10. The metallized ceramic substrate 10 makes electrical contact with circuitry in printed circuit board 15 through pins 18. The package includes a primary heat sink 20. This heat sink has a compartment for fluid 20A and inlet and outlet ports 20B and 20C. The module also includes a second heat sink 30. This heat sink extends below metallized ceramic 10. Holes 30A are provided so that pins 18 do not make electrical contact with this heat sink.