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Electroplating Of MLC Substrates Using A Nonprecious Metal Shorting Material

IP.com Disclosure Number: IPCOM000067687D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kowalczyk, RJ [+details]

Abstract

In MLC (multilayer ceramic) gold electroplating technology, a conductive paste is screened onto portions of the substrate prior to plating to provide a conductive path to metallurgical areas which are to be electroplated. Until recently, a precious metal paste, which is resistant to oxidation, was required to provide this function. The following new process permits the use of a nonprecious metal paste.