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Method Of Polishing Semiconductor Wafers

IP.com Disclosure Number: IPCOM000067694D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Schuenzel, EC [+details]

Abstract

Free polishing normally polishes a wafer on both sides simultaneously. Single side polishing of two wafers is accomplished by either applying a layer of temporary adhesive to hold two wafers together, as shown in Fig. 1, or by placing a cushioning layer of material between two wafers , as illustrated in Fig. 2. In each case the nests are made thicker so that the two wafers would not ride out of the pocket. Alternate methods of bonding the wafers together would be to use double adhesive sided paper or coated plastic, such as MYLAR* film. * Trademark of E.I. Du Pont de Nemours & Co.