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Minimum Cost Concept For Contactless Air Film Handling Of Wafer Sizes Larger Than 3-1/4 Inches

IP.com Disclosure Number: IPCOM000067706D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hassan, JK Paivanas, JA [+details]

Abstract

An advanced track system design is described for handling various size wafers (e.g., 57 mm and 127 mm diameter) on a supporting air film. The film is supplied by long feed holes (Fig. 1) and exerts multidirectional control of the wafer motion. This capability is due to embodied suction generating and flow redirection fluid mechanics phenomena. Characteristically, motion takes place on an air film of essentially uniform thickness and without any contact of the wafer with lateral bounding guides. The design can be implemented in various forms and features a moderate cost and operation at blower air supply conditions.