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Low Dielectric Constant Material For Printed Circuit Boards

IP.com Disclosure Number: IPCOM000067802D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Haining, FW Herbaugh, DG [+details]

Abstract

It is advantageous to provide a material having a low dielectric constant (E(r)) for use as a dielectric layer between the signal and power planes of a printed circuit board. Normally, an epoxy laminating resin is used for the purpose of fabricating the several layers of a circuit board. As the E(r) goes down, the electrical performance of the circuitry, i.e., time delay, capacitance and coupled noise, is improved.