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Single Photoresist For Polyimide-Insulator Via

IP.com Disclosure Number: IPCOM000067817D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Agnihotri, RK Chiu, GT Johnson, C [+details]

Abstract

Vias formed through polyimide and insulator layers, such as quartz or silicon nitride, require two photoresist layers to open a large polyimide window and a smaller insulator window. A single photoresist layer is used for etching both windows for vias between metal layers.