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Method Of Controlling A Paste Filled Via Dia meter In A Ceramic Green Sheet

IP.com Disclosure Number: IPCOM000067819D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Desai, KS Melvin, GE [+details]

Abstract

In the fabrication of multilayer ceramic substrates, ceramic green sheets are punched to form via holes which are subsequently filled with conductive paste. The diameter of the paste frequently exceeds the diameter of the punched hole because the paste bleeds over the edge of the hole, and may also be forced over the edge during the screening process depending on the firmness of the backing layer. When the metalfilled via is used as a pad for solder-joining devices, maintaining the pad diameter is extremely important.